In the previous article, we talked about “How to Increase the bonding force for PCBA by using “Copper” base as the PCB surface finish“. Today, we will discuss further how the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs of the BGA package affect the solderability and how these two types of pads affect the bonding force of PCA.
Increasing the solder contact area of a component terminal or leads will generally improve the solderability of the component, as it provides more surface area for the solder to wet and bond to the terminal. This can result in a stronger and more reliable solder joint.