Category Archives: Reliability
May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It
One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons
In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect, also known as blistering, is a phenomenon in PCBs and electronic components in which demamination or internal bubbles can form when the material is exposed to high temperatures during soldering. The phenomenon is similar to popcorn popping and … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
