Category Archives: Reliability
Jul18
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?
In the early days, when electronic component design and manufacturing were still developing, the “burn-in” solution was used to screen out defective electronic components and products. This process allowed early-failing products to be identified and eliminated, preventing defective items from … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
Dec26
Another Option for Increasing Solder Volume in SMT – Solder Preforms
Figure：Another Option for Increasing Solder Volume in SMT – Solder Preforms “Solder preforms” are pre-shaped small solid solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on … Continue reading
Aug17
An Option for Adding More Solder – Solder Preforms
“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading
