Category Archives: Reliability


Jun19
Will Increasing Solder Paste Volume Help Prevent MLCC Cracking?

post on June 19, 2017

Figure: Will Increasing Solder Paste Volume Help Prevent MLCC Cracking? Recently, Workingbear received a complaint from R&D asking us to increase the solder paste volume on the MLCC (Multilayer Ceramic Capacitor) component pads to improve a capacitor cracking issue. R&D … Continue reading →

Design, Manufacture, PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (8,284)     comment (0)
, ,

Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength

post on October 1, 2015

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading →

PCB/FPC/PTF, Reliability, SMT, Soldering     WorkingBear    Views (27,343)     comment (0)
,

May14
Temperature Environmental Cycle Profile

post on May 14, 2015

The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain … Continue reading →

Design, Reliability     WorkingBear    Views (7,481)     comment (0)

May12
Humidity Temperature Cycle Profile

post on May 12, 2015

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in … Continue reading →

Design, Reliability     WorkingBear    Views (9,635)     comment (0)