Category Archives: Reliability


Jul24
Understanding ORT: What It Is and How It Differs from REL (Reliability)

ORT stands for Ongoing Reliability Test, and sometimes it’s written as Ongoing Reliability Testing. ORT is a very important quality control measure in electronics manufacturing. Its purpose is to continuously monitor the reliability of products during mass production, so that … Continue reading →

Jun26
What is Environmental Stress Screening (ESS)?

Environmental Stress Screening (ESS) is a method used to apply certain environmental and operational stresses—such as power on/off cycles, bias voltage, pressure, thermal cycling, and vibration—to new or repaired products (usually electronics or components). The idea is to expose hidden … Continue reading →

Jun12
Impact Drop Test Requirements in Electronic Product Development

During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases: Product Drop Test – Testing the device without packaging. Packagage Drop Test – Evaluating the … Continue reading →

Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing

From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading →

May29
Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions

Workingbear’s company was having a tough time with a strange issue: intermittent micro-short circuits inside the layers of the PCB. Since the shorts didn’t show up near any components, it was really hard to figure out what was wrong. Recently, … Continue reading →