Author Archives: WorkingBear

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May14
Temperature Environmental Cycle Profile

The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain … Continue reading

May12
Humidity Temperature Cycle Profile

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in … Continue reading

May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

Recently we met a DDR memory BGA (Ball Grid Array) soldering fail issue. Actually the is HIP (Head-In-Pillow) that two balls under the BGA package. We sent a people to field to check how customer do the operation and found … Continue reading

May01
How come the screw boss crack after mold-in screw insert?

Actually this is long ago issue and WorkingBear write down this article just for a record. One day we received a complaint from field and complained our product had plastic house broken issue. Actually this crack can be saw from … Continue reading

Apr29
How to design LCM gasket/cushion for manufacture?

The LCM (LCD Module) is a common component for the electronic products. Almost of the LCM was made by glass and it is brittle and  break easily while hit or drop on the floor due to handle careless. As product … Continue reading

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