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Author Archives: WorkingBear
Jun24
Case study for the mold-in insert screw boss broken
Last time WorkingBear mentioned the potential root causes to bring the screw boss crack after mold-in screw nut insert. Actually we received the complaint from the field then asked EMS and plastic supplier to double check their inventory and found … Continue reading
Jun17
Selectively increase solder paste volume solutions
Why need to partially increase the solder paste volume? This is in order to meet current smaller and thinner electric component design, the stencil thickness is made as thin as possible to accurately control the tiny solder paste which print … Continue reading
Jun10
PCB rework: Selective solder mask removal by laser
Did you ever met a trouble need to rework to remove the solder mask from the PCB? If yes then how you did? We usually remove the solder mask manually by knife or hand grinding tool. But these kinds of … Continue reading
Jun03
TQRDCE Performance Expectations and Review
This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The strategy of company for establishing and maintaining long-term working relationships is through creating and monitoring mutual performance expect ions and measurements. Performance metrics, constructive feedback, as … Continue reading
May27
Improve BGA solderability by partial increase solder paste volume
How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading
