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Author Archives: WorkingBear
May27
Improve BGA solderability by partial increase solder paste volume
How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading
May20
Shipping carton drop/impact test condition
The electronic industry grows quickly. Each vendor takes responsible to his own component only to make it good and low cost. Take a flashlight manufacturer as example. There are bulb, wires, switch, spring, and plastic or metal housing make up … Continue reading
May14
Temperature Environmental Cycle Profile
The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain … Continue reading
May12
Humidity Temperature Cycle Profile
The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in … Continue reading
May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?
Recently we met a DDR memory BGA (Ball Grid Array) soldering fail issue. Actually the is HIP (Head-In-Pillow) that two balls under the BGA package. We sent a people to field to check how customer do the operation and found … Continue reading
