Category Archives: Glue/adhesive/epoxy/underfill,


Jul01
Why do thinner PCBs will need carrier for reflow process?

post on July 1, 2015

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading →

Design, Glue/adhesive/epoxy/underfill,, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (13,274)     comments (2)
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