Category Archives: Design

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May27
Improve BGA solderability by partial increase solder paste volume

How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading

May20
Shipping carton drop/impact test condition

The electronic industry grows quickly. Each vendor takes responsible to his own component only to make it good and low cost. Take a flashlight manufacturer as example. There are bulb, wires, switch, spring, and plastic or metal housing make up … Continue reading

May14
Temperature Environmental Cycle Profile

The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain … Continue reading

May12
Humidity Temperature Cycle Profile

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in … Continue reading

May01
How come the screw boss crack after mold-in screw insert?

Actually this is long ago issue and WorkingBear write down this article just for a record. One day we received a complaint from field and complained our product had plastic house broken issue. Actually this crack can be saw from … Continue reading

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