Category Archives: Design


Apr07
Solution to the Drop of First-Side Part during the Second Reflow Soldering

First of all, with the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes meet serious labor shortage. Second, the Industry 4.0 promotes the requirement of factory automation for each EMS. Therefore, many parts … Continue reading

Jul01
Why thinner PCB will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear always find there is tug of war between Designer, Marketing and Manufacturer. The Marketing always like the design be thin, sleek, and modern looking. The designer always think fabrication is easy. The … Continue reading

Jun24
Case study for the mold-in insert screw boss broken

Last time WorkingBear mentioned the potential root causes to bring the screw boss crack after mold-in screw nut insert. Actually we received the complaint from the field then asked EMS and plastic supplier to double check their inventory and found … Continue reading

May27
Improve BGA solderability by partial increase solder paste volume

How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading

May20
Shipping carton drop/impact test condition

The electronic industry grows quickly. Each vendor takes responsible to his own component only to make it good and low cost. Take a flashlight manufacturer as example. There are bulb, wires, switch, spring, and plastic or metal housing make up … Continue reading