Category Archives: Design


Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints

post on November 13, 2019

The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading →

Design, EDX/EDS/SEM/IMC/FTIR, SMT, Soldering     WorkingBear    Views (19,619)     comment (0)
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Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force

post on October 30, 2019

This article will talk about the composition of the PCBA bonding-force. There are numerous factors and elements involved in PCBA bonding force. However, Workingbear believes that we can utilize the findings of the red dye test to examine this issue. … Continue reading →

Design, SMT, Soldering     WorkingBear    Views (14,511)     comments (2)
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Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force

post on September 25, 2019

What is the actual root cause of  BGA solder ball cracking? Stress is higher than its bonding-forces. The root cause of BGA solder ball cracked is stress higher than bonding-forces. Stress is higher than bonding-force is the certain result of … Continue reading →

Design, SMT, Soldering     WorkingBear    Views (13,995)     comment (0)
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Jun19
Will Increasing Solder Paste Volume Help Prevent MLCC Cracking?

post on June 19, 2017

Figure: Will Increasing Solder Paste Volume Help Prevent MLCC Cracking? Recently, Workingbear received a complaint from R&D asking us to increase the solder paste volume on the MLCC (Multilayer Ceramic Capacitor) component pads to improve a capacitor cracking issue. R&D … Continue reading →

Design, Manufacture, PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (8,279)     comment (0)
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Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

post on January 5, 2017

Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading →

Design, Manufacture, SMT     WorkingBear    Views (8,588)     comment (0)
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