Author Archives: WorkingBear


Nov14
How to print solder paste on PC Board and screen printing notices?

Printing the solder paste on the PCB (Printed Circuit Board) and go through reflow oven to re-melt the solder paste and solder the electronic components on PCB is most common process in today’s electronics manufacturing industry. Printing the solder paste … Continue reading →

Jun19
Will Increasing Solder Paste Volume Help Prevent MLCC Cracking?

Figure: Will Increasing Solder Paste Volume Help Prevent MLCC Cracking? Recently, Workingbear received a complaint from R&D asking us to increase the solder paste volume on the MLCC (Multilayer Ceramic Capacitor) component pads to improve a capacitor cracking issue. R&D … Continue reading →

Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading →

May03
Trouble Shooting Guide for Plastic Injection

Trouble Suggested Remedies (Solutions) DIMENSIONAL PROBLEMS Shot-to-shot dimensional variations Increase injection pressure Maintain uniform pad (cushion) Repair leaking back flow value if pad cannot be maintained Increase screw forward time Maintain uniform cycle Eliminate un-melted particles (see below) Use larger … Continue reading →

Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering

Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading →