Author Archives: WorkingBear


Jun19
Will Increasing Solder Paste Volume Help Prevent MLCC Cracking?

post on June 19, 2017

Figure: Will Increasing Solder Paste Volume Help Prevent MLCC Cracking? Recently, Workingbear received a complaint from R&D asking us to increase the solder paste volume on the MLCC (Multilayer Ceramic Capacitor) component pads to improve a capacitor cracking issue. R&D … Continue reading →

Design, Manufacture, PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (8,262)     comment (0)
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Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

post on January 5, 2017

Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading →

Design, Manufacture, SMT     WorkingBear    Views (8,581)     comment (0)
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May03
Trouble Shooting Guide for Plastic Injection

post on May 3, 2016

Trouble Suggested Remedies (Solutions) DIMENSIONAL PROBLEMS Shot-to-shot dimensional variations Increase injection pressure Maintain uniform pad (cushion) Repair leaking back flow value if pad cannot be maintained Increase screw forward time Maintain uniform cycle Eliminate un-melted particles (see below) Use larger … Continue reading →

Plastic, Quality     WorkingBear    Views (5,758)     comment (0)

Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering

post on April 7, 2016

Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading →

Design, Manufacture, SMT, Soldering     WorkingBear    Views (8,828)     comment (0)
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Mar09
What Process Impact of Substituting SMDs with Paste-In-Hole components?

post on March 9, 2016

One day, my manager asked me a question: “Will changing the components from SMDs (Surface Mount Devices) to THDs (Through Hole Devices) and using the PIH (Paste-In-Hole) process affect the process and design?” I later realized that the question aimed … Continue reading →

Manufacture, SMT, Soldering     WorkingBear    Views (7,608)     comment (0)
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