Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips

post on January 24, 2025

Two Major Potential Issues with ENIG Surface PCB Pads (Black Nickel and Phosphorus-Rich Layers) and How to Prevent Them

With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due to its simplicity and lower cost compared to other surface treatments, as well as its numerous advantages, including:

  1. Excellent reworkability: ENIG allows for multiple soldering processes without compromising quality.
  2. Superior flatness: Perfect for fine-pitch components.
  3. Strong resistance to oxidation: Suitable for long-term storage.
  4. Versatility: Can be used for contact circuits like keypads.

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EDX/EDS/SEM/IMC/FTIR,, PCB/FPC/PTF, Process, Quality, Reliability, SMT, Soldering     WorkingBear    Views (2,083)     comment (0)
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Jan16
Inspection Methods for BGA Solder Ball Wettability and Soldering Defects

post on January 16, 2025

Inspection Methods for BGA Solder Ball Wettability and Soldering Defects

This is a summary post aimed at providing some guidance to newcomers in the electronics assembly field on methods for analyzing the solderability of BGA (Ball Grid Array) solder balls. Workingbear decided to write this after seeing someone ask about this topic in an online forum. Some of the content might overlap with topics already covered in previous blog posts.

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Quality, Soldering, Test/Inspection     WorkingBear    Views (2,059)     comment (0)
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Jan09
Why Do Electronic Component Leads Turn Yellow, Purple, or Blue After Reflow? Causes and Solutions

post on January 9, 2025

Why Do Electronic Component Leads Turn Yellow, Purple, or Blue After Reflow? Causes and Solutions</strong

Workingbear recently received questions from readers about electronic component soldering leads turning yellow or showing discoloration (purple, blue, etc.) after going through the reflow oven. Why do the leads of components discolor after reflow? Does this discoloration affect product functionality? And how should we handle discolored components or assembled PCBs? Let’s dive into these questions for this article.

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Process, Quality, SMT, Soldering     WorkingBear    Views (2,019)     comment (0)
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Jan02
How to Monitor the Quality of Incoming Plastic Resin?

post on January 2, 2025

How to Monitor the Quality of Incoming Plastic Resin

This is a answer to a question from a community member asking about plastic quality control. The question was: “Can we rely solely on MI (Melt Index) values to monitor the quality of plastic resins? And does an increase in MI indicate plastic property degradation?” Many people believe there is no direct correlation between MI values and cracking in plastic products.

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Plastic, Quality     WorkingBear    Views (1,066)     comment (0)

Dec26
The Relationship Between MFI and Re-grind/Recycle Resin in Plastics

post on December 26, 2024

The Relationship Between MFI and Re-grind/Recycle Resin in Plastics

When discussing whether using re-grind resin in plastics leads to degradation, Workingbear sought advice from industry experts. Most professionals agreed that it does cause degradation. However, opinions on whether MFI values can reliably indicate the presence of re-grind resin are divided within the industry. The conclusion? It’s uncertain but worth considering. Below is a summary of the information compiled by Workingbear.

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Plastic, Quality, Reliability     WorkingBear    Views (1,091)     comment (0)