I am a Manufacturing Process Engineer (MPE)

Below are recommendations for BGA pad design to enhance the soldering strength from Workingbear.

We had several pages talking about the relationship between solder cracking and bonding force. Workingbear personally doesn’t think that making design a change to the pad of PCB can help much with the ability of BGA soldering to resist stress, as it is like a drop in the bucket! A board’s bending or deformation can easily negate all your efforts in improving pad design and solderability. Workingbear still thinks that strengthening the mechanism design and improving the board’s ability to resist bending and deformation is the best solution to fix BGA solder cracking.

read more…》

In the previous article, we talked about “How to Increase the bonding force for PCBA by using “Copper” base as the PCB surface finish“. Today, we will discuss further how the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs of the BGA package affect the solderability and how these two types of pads affect the bonding force of PCA.

Increasing the solder contact area of a component terminal or leads will generally improve the solderability of the component, as it provides more surface area for the solder to wet and bond to the terminal. This can result in a stronger and more reliable solder joint.

read more…》

Following last discussion, we learned that solder cracking is caused when the stress placed upon it exceeds the strength of the bonding force. However, it’s possible to address this issue by increasing the bonding force of the printed circuit board assembly (PCBA). By doing so, we can effectively eliminate solder cracking, making it a more reliable and robust technology for a wide range of applications.

read more…》