How to increasing the ability of components to resist stress?(Continuing from the previous article)
2. No solder balls on BGA four corners, or use dummy balls instead of them.
If you had studied the actual phenomenon of BGA solder cacking under a microscope, you should find that most BGAs start to break from the solder balls at the four corners. This is because the four corners of the BGA have the farthest distance from the force moment of the board bending, so they are also the positions that sustain the maximum stress during the board bending and warping, and of course, are the most likely to cause solder ball fractures.