“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder paste. This helps when the solder paste volume is constrained due to the limitation of stencil thickness. It makes the solder joints stronger and better, and it also helps to improve voids in the solder.
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