Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress

電子零件掉落或錫裂一定是SMT製程問題迷思(12)?製造工廠中可能出現較大應力的製程

Manufacturing processes that may result in high stress in factories

Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.

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Mar29
Why BGA soldering ball always crack(11)? Stress is the Biggest Culprit in Causing BGA Solder Joint Cracks

The earlier sections of the article that Workingbear spent a lot of time discussing how to strengthen the bonding force of PCBAs and increase the stress resistance of electronic products. Now, we can finally talk about the biggest culprit causing BGA solder joint cracks: stress.

To completely solve the problem of BGA solder joint cracks, we must understand where stress comes from and treat it accordingly to avoid or reduce its impact. Without addressing stress issues, all other efforts will only be half as effective, just like managing floodwaters – clearing them is always more effective than building barriers.

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Mar21
Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change

電子零件掉落或錫裂一定是SMT製程問題迷思(10)?透過機構設計降低應力對電路板變形之影響

Reducing the Impact of Stress on PCB Deformation through Mechanism Design

In earlier sections, WorkingBear briefly mentioned the possible solution by  changing mechanism design to address the problem of solder cracking. One such approach involves replacing the SMDs (surface mount devices) that are prone to falling off with HTDs (through hole devices). This modification can significantly improve the strength of solder joints.

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Mar15
Why BGA soldering ball always crack(9)? Increase the resistance of components to stress

How to increasing the ability of components to resist stress?(Continuing from the previous article)

2. No solder balls on BGA four corners, or use dummy balls instead of them.

If you had studied the actual phenomenon of BGA solder cacking under a microscope, you should find that most BGAs start to break from the solder balls at the four corners. This is because the four corners of the BGA have the farthest distance from the force moment of the board bending, so they are also the positions that sustain the maximum stress during the board bending and warping, and of course, are the most likely to cause solder ball fractures.

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Mar10
Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending

same PCB layers with different stack-up

In the previous article, WorkingBear talked about how to improve the adhesion of PCA to resist the impact of stress. Today, We will move on to another topic: “How to increase the ability of components or circuit boards to resist stress?” Because the maximum impact of stress on solder cracking is board bending, we only need to think about how to enhance the product’s ability to resist the stress impact caused by board bending to solve the problem of solder cracking.

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