Category Archives: SMT


May30
The Hidden Dangers of Using Overdue PCBs: Can Baking Salvage Them?

post on May 30, 2023

All materials actually have its shelf-life, some shorter and some longer than others. So what happens when expired materials are used? Think about what will happens when you eat expired food. What about using expired Printed Circuit Boards (PCBs)?

PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (4,600)     comment (0)

May18
Clarifying the Concept of Electronic Component Soldering Strength

post on May 18, 2023

While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading →

Connector, Quality, Reliability, SMT, Soldering     WorkingBear    Views (2,926)     comment (0)
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May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs

post on May 2, 2023

Figcaption: Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the … Continue reading →

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (10,483)     comment (0)
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Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

post on April 21, 2023

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading →

Manufacture, Moisture Sensitive, Process, Quality, SMT     WorkingBear    Views (8,280)     comment (0)

Apr13
Red Dye Penetration Test to check for BGA solder joint cracking

post on April 13, 2023

Figure: Using the Red Dye Penetration Test to Detect Cracked BGA Solder Joints The Red Dye Penetration Test also known as Red Dye test or Dye and Pry test, is a technique used to inspect for surface-mount technology (SMT) defects such … Continue reading →

Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (12,568)     comment (0)
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