Category Archives: Process


Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?

post on July 27, 2023

WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (6,262)     comment (0)
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Jul04
Exploring EVT/DVT/PVT: Explaining the Three Crucial Validation Stages in New Product Development

post on July 4, 2023

When developing a new product, it is common to conduct a “pilot run” to obtain a prototype sample. This serves two purposes: firstly, it allows developers to further test and validate the prototype’s functionality, and secondly, it helps the manufacturing … Continue reading →

Design, Management, Process     WorkingBear    Views (11,504)     comment (0)
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Jun13
How to Determine Whether Underfill is Needed for BGA?

post on June 13, 2023

A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (7,369)     comment (0)
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Jun06
Questions from Newcomer: Why is Solder Paste Needed for SMT Reflow since BGA Already has Solder Balls? Is Solder Paste Needed for BGA Repair?

post on June 6, 2023

Questions from a newcomer about electronic manufacturing assembly process: Since there are already solder balls locate on the BGA substrate, why is it necessary to apply solder paste on the PCB pads during SMT reflow? Is it necessary to apply … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (4,198)     comment (0)
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Jun01
What is Wave Soldering? Laminar Wave and Turbulent Wave Purpose

post on June 1, 2023

Before the development of Surface Mount Technology (SMT), almost all printed circuit board assemblies (PCBAs) had to go through the process of wave soldering to achieve the purpose of soldering electronic components to the board. The process of “wave soldering” … Continue reading →

Process, Soldering     WorkingBear    Views (14,571)     comments (1)
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