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Category Archives: SMT
May18
Clarifying the Concept of Electronic Component Soldering Strength
While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading
May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs
Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the advantages and disadvantages for them? What are the design recommendations for them? … Continue reading
Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers
Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading
Apr13
Red Dye Penetration Test to check for BGA solder joint cracking
The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on … Continue reading
Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading
