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Category Archives: Process
Dec05
Both solder joint bridging and open solder joint happen at same BGA?
Is that possible for both solder joint bridging and open solder joint defect occur in the same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is rare to observe both solder joint bridging and open solder joint … Continue reading
Jul01
Why do thinner PCBs will need carrier for reflow process?
As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want strong, robust, sturdy assemblies that … Continue reading
