Category Archives: Process


Apr09
Selective Mask Wave Soldering Process: The Optimal Timing and Limitations

post on April 9, 2024

Workingbear initially thought that wave soldering machines should have been relegated to museums by now! However, despite the decades-long development of Surface Mount Technology (SMT), many PCBs still undergo wave soldering processes. But nowadays, most wave soldering processes employ Selective … Continue reading →

Process, Soldering     WorkingBear    Views (7,475)     comment (0)
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Apr02
Can Surface Mount Devices Run Through the Wave Soldering Without Falling Into the Pot?

post on April 2, 2024

In previous discussions, Workingbear introduced the “wave soldering” process, which was used in early day of PCBA soldering. SMT assembly, on the other hand, emerged later. Can wave soldering be used for Surface Mount Devices (SMDs) after SMT placement? Workingbear … Continue reading →

Process, SMT, Soldering     WorkingBear    Views (6,242)     comment (0)

Mar26
What is AOI? What Defects Can 2D AOI Detect in PCB Assembly?

post on March 26, 2024

AOI (Auto Optical Inspection) is an automated optical recognition system that has become widely used in the electronics industry for inspecting the quality of soldering, component placement accuracy and the presence of missing components on PCBA (Printed Circuit Board Assembly) … Continue reading →

Process, Quality, SMT, Test/Inspection     WorkingBear    Views (9,901)     comment (0)
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Mar12
Why Do PCBs Have Those Small Circles? What purpose of Test Points on PCBs?

post on March 12, 2024

Have you ever noticed those tiny circles on PCBs and wondered why they’re there? They don’t seem to have any parts soldered onto them, and some don’t even have solder paste. Well, those small circles are called test points, and … Continue reading →

PCB/FPC/PTF, Process, Test/Inspection     WorkingBear    Views (4,729)     comment (0)

Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?

post on February 27, 2024

In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (8,892)     comment (0)
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