Category Archives: PCB/FPC/PTF
Mar10
Why Do BGA Solder Balls Keep Cracking (8)? Increase PCB stiffness to resist stress and avoid board bending
In the previous article, WorkingBear talked about how to improve the adhesion of PCA to resist the impact of stress. Today, We will move on to another topic: “How to increase the ability of components or circuit boards to resist … Continue reading
Jun19
Will Increasing Solder Paste Volume Help Prevent MLCC Cracking?
Figure: Will Increasing Solder Paste Volume Help Prevent MLCC Cracking? Recently, Workingbear received a complaint from R&D asking us to increase the solder paste volume on the MLCC (Multilayer Ceramic Capacitor) component pads to improve a capacitor cracking issue. R&D … Continue reading
Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength
Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading
Jul01
Why do thinner PCBs will need carrier for reflow process?
As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want strong, robust, sturdy assemblies that … Continue reading
