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Category Archives: PCB/FPC/PTF
Mar29
Why BGA soldering ball always crack(11)? Stress is the Biggest Culprit in Causing BGA Solder Joint Cracks
The earlier sections of the article that Workingbear spent a lot of time discussing how to strengthen the bonding force of PCBAs and increase the stress resistance of electronic products. Now, we can finally talk about the biggest culprit causing … Continue reading
Mar21
Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change
Reducing the Impact of Stress on PCB Deformation through Mechanism Design In earlier sections, WorkingBear briefly mentioned the possible solution by changing mechanism design to address the problem of solder cracking. One such approach involves replacing the SMDs (surface mount … Continue reading
Mar15
Why BGA soldering ball always crack(9)? Increase the resistance of components to stress
How to increasing the ability of components to resist stress?(Continuing from the previous article) 2. No solder balls on BGA four corners, or use dummy balls instead of them. If you had studied the actual phenomenon of BGA solder cacking … Continue reading
Mar10
Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending
In the previous article, WorkingBear talked about how to improve the adhesion of PCA to resist the impact of stress. Today, We will move on to another topic: “How to increase the ability of components or circuit boards to resist … Continue reading
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
