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Category Archives: Design
Mar21
Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change
Reducing the Impact of Stress on PCB Deformation through Mechanism Design In earlier sections, WorkingBear briefly mentioned the possible solution by changing mechanism design to address the problem of solder cracking. One such approach involves replacing the SMDs (surface mount … Continue reading
Mar15
Why BGA soldering ball always crack(9)? Increase the resistance of components to stress
How to increasing the ability of components to resist stress?(Continuing from the previous article) 2. No solder balls on BGA four corners, or use dummy balls instead of them. If you had studied the actual phenomenon of BGA solder cacking … Continue reading
Mar10
Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending
In the previous article, WorkingBear talked about how to improve the adhesion of PCA to resist the impact of stress. Today, We will move on to another topic: “How to increase the ability of components or circuit boards to resist … Continue reading
Mar07
Why BGA soldering ball always crack(7)? The Bonding force between solder pad of copper foil and PCB substrate
PCB is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP) stacked together. In modern PCB manufacturing, CCL has become a standard material. Each CCL manufacturer provides customers with product specifications that indicate the peel strength of the … Continue reading
Mar01
Why BGA soldering ball always crack(6)? The recommendation of BGA pad design from workingbear
Below are recommendations for BGA pad design to enhance the soldering strength from Workingbear. We had several pages talking about the relationship between solder cracking and bonding force. Workingbear personally doesn’t think that making design a change to the pad … Continue reading
