
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then freezing again—the time in between is the “liquid” phase. This period is a critical parameter in reflow soldering because it determines whether the solder paste fully melts and properly wets the pads and component leads to form good solder joints. In soldering, joint quality is largely judged by wetting performance.




