At Workbearing’s electronic manufacturing service (EMS) factory and warehouse, products often need to be reworked for various reasons, such as customer requests or converting products for inventory purposes. While removing labels is not the most crucial task in the rework process, there is a need for a better and efficient way to remove labels without causing damage to the product or packaging box.
Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture.
Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory floor or production line, as well as any environment the components are exposed to after being removed from vacuum-sealed packaging.
Please note that liquid or solid water cannot be counted as part of humidity! In fact, the human body can feel humidity. In a high humidity environment, you can feel that sticky sensation, like when it’s about to rain but hasn’t started yet, and your whole body feels damp.
“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability.
Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) than typical PCB materials. As a result, temperature cycling tests often cause relative displacement, leading to mechanical fatigue and problems such as solder joint detachment or cracking. Later, this Underfill technology was also widely used under some BGA packages to improve their reliability when soldered onto the PCB and to prevent them from falling or dropping.
The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on the SMT of printed circuit board (PCB) assemblies, and can assist engineers in verifying the quality of electronic component soldering.
Because the Red Dye test is a destructive experiment, it is typically only used on assembled PCBs (printed circuit boards) that cannot be inspected for issues using other non-destructive methods. Additionally, it is almost exclusively used for analyzing ICs (integrated circuits) with BGA (Ball Grid Array) packaging because the solder joints are located beneath the component and cannot be visually inspected using optical instruments.
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future!
After discussing the precautions and solutions for stress during assembly, let’s talk about the biggest source of stress for electronic products: the usage environment of end customers.
