We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to assess the customer’s operation, discovering that the product failed to power on. Interestingly, applying finger pressure to the DDR memory component would successfully power it on.
Why did this occur? The production line claimed the products underwent a 12-hour power-on Burn/In (B/I) process at 40°C but didn’t screen out the defect. So, why did we still observe this type of BGA soldering defect in the field?
So, how EMS fabricate a PCB Assembly? It is almost automatic production line now through SMT or wave soldering process to solder the electronic components on the board to instead of hand soldering by iron. Of course, you still can hand solder all electronic components on the board as manual by yourself but you must take high risk for the poor solderability quality and can’t do it mass production. Besides, the 0201 small chip are hard to be hand soldered on board and some of the package that design the soldering pads under the package body can’t be hand soldered. For example BGA, QFN, LGA package.
As my personal feeling that Right-angle FPC ZIF connector is really more easily to use than Drawer type of ZIF connector. Even right-angle connector is good but do you know how to select a good design of this kind of right angle connector?
