Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the PCB are tiny size. This make the SMT manufacturing process more difficult and challenge.
You may know that portable device always has BGA malfunction risk during impact drop test. Most of company dispense the underfill glue to fix this kind of BGA crack issue. My company did the same thing too. WorkingBear think there shall be another way to enhance the soldering pad strength to eliminate the underfill glue since underfill process spend money and waste labor hours.