PCB is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP) stacked together. In modern PCB manufacturing, CCL has become a standard material. Each CCL manufacturer provides customers with product specifications that indicate the peel strength of the CCL. From these specifications, we can see that the peel strength is higher when using 1.0 oz copper foil thickness than when using 0.5 oz. Different models and manufacturers of CCL also have different peel strengths, so selecting the appropriate CCL specifications is necessary to enhance the bonding force between the copper foil and PCB substrate.
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