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Category Archives: Soldering
Apr25
How are decisions made regarding stencil thickness, aperture, and shape? How can solder beads be prevented?
A user asked: “How is the thickness of the stencil determined? What considerations are there for the shape of the stencil apertures?” The thickness of the stencil is mainly determined by the amount of solder paste needed for component soldering. … Continue reading
Apr18
Pros and Cons of Selective Soldering Machines
Selective soldering machines are a compromise solution in modern PCB Assembly (PCBA)processes. Despite the advancements in surface mount technology (SMT), electronic components still rely on traditional Through-Hole Technology (THT) due to cost or material constraints. Even though most components on … Continue reading
Apr09
Selective Mask Wave Soldering Process: The Optimal Timing and Limitations
Workingbear initially thought that wave soldering machines should have been relegated to museums by now! However, despite the decades-long development of Surface Mount Technology (SMT), many PCBs still undergo wave soldering processes. But nowadays, most wave soldering processes employ Selective … Continue reading
Apr02
Can Surface Mount Devices Run Through the Wave Soldering Without Falling Into the Pot?
In previous discussions, Workingbear introduced the “wave soldering” process, which was used in early day of PCBA soldering. SMT assembly, on the other hand, emerged later. Can wave soldering be used for Surface Mount Devices (SMDs) after SMT placement? Workingbear … Continue reading
Mar19
The Purpose of Nickel (Ni) Plating on Components or Circuit Boards in the Electronics Industry
Firstly, let’s clarify that Workingbear is not a metallurgy expert. The content of this article is based purely on personal experience and information gathered from the internet. If there are any errors, feel free to point them out for correction. … Continue reading
