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Category Archives: Soldering
Aug01
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures
In recent years, the commercial application of 3D CT X-Ray has become increasingly noteworthy. As the technology matures, more companies are investing in its development, making the equipment more affordable, though still not quite at a consumer-friendly price point. Additionally, … Continue reading
Jul25
Effects of Nitrogen (N2) in SMT Reflow on Various Soldering Defects
“Oxidation” is a major enemy of solder quality, but oxidation is a natural law of elements striving for stability that cannot be avoided. Using nitrogen (N2) to isolate solder from oxygen (O2) is one of the few effective methods currently … Continue reading
Jun20
The Benefits of Using SMT Synthetic Stone or Aluminum Alloy for Reflow Carriers
With the advancement of technology, electronic products are becoming thinner and more compact. Consequently, electronic components are also getting smaller, and even the thickness of printed circuit boards (PCBs) is decreasing. The thinnest PCB Workingbear has seen is 0.4mm. Such … Continue reading
May23
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
