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Category Archives: Reliability
May18
Clarifying the Concept of Electronic Component Soldering Strength
While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength
Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading
May14
Temperature Environmental Cycle Profile
The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain … Continue reading
May12
Humidity Temperature Cycle Profile
The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in … Continue reading
