Category Archives: Quality


Jul01
Why do thinner PCBs will need carrier for reflow process?

post on July 1, 2015

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading →

Design, Glue/adhesive/epoxy/underfill,, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (14,748)     comments (2)
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Jun24
Case study for the mold-in insert screw boss broken

post on June 24, 2015

In a previous discussion, WorkingBear identified potential root causes for screw boss cracking after mold-in screw nut insertion. Following a complaint from the field, we asked EMS and the plastic injection supplier to double-check their inventory and found that approximately … Continue reading →

Design, Plastic, Quality     WorkingBear    Views (13,648)     comment (0)
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Jun10
PCB rework: Selective solder mask removal by laser

post on June 10, 2015

As an engineer in the electronics manufacturing industry, have you ever encountered the need to rework a printed circuit board (PCB) to remove the solder mask? If so, how did you approach this problem? Traditionally, the solder mask is manually … Continue reading →

Manufacture, Quality     WorkingBear    Views (10,738)     comment (0)

Jun03
TQRDCE Performance Expectations and Review

post on June 3, 2015

This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and … Continue reading →

Manufacture, Quality     WorkingBear    Views (22,418)     comment (0)

May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

post on May 27, 2015

Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading →

Design, Manufacture, Quality, Soldering     WorkingBear    Views (9,939)     comment (0)
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