Category Archives: Quality


May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading

May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading

May01
Why Do Screw Bosses Crack After Mold-In Screw Inserts? Common Causes and Solutions

This story is long-standing memory, but WorkingBear is documenting it here for reference and as a learning record. One day, we received a customer complaint regarding a product with a plastic housing that had cracked. The issue was visually striking, … Continue reading

Apr24
How to select a good actuator design for right angle connector?

As my personal feeling that Right-angle FPC ZIF connector is really more easily to use than Drawer type of ZIF connector. Even right-angle connector is good but do you know how to select a good design of this kind of … Continue reading

Apr23
How many dimple need to be used for keypad metal dome?

Last article I mentioned that my company applied the metal dome without dimple as keypad contact solution just like the cell phone but we had trouble and met keypad press insensitive  issue. Now we solved the problem by adding the … Continue reading