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Category Archives: Process
Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers
Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading
Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly
“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability. Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) … Continue reading
Apr13
Red Dye Penetration Test to check for BGA solder joint cracking
The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on … Continue reading
Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading
Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？
What is the IMC, the Intermetallic Compound? We always heard the manufacturing engineer or some of Mechanical Engineer talking about this keyword when discussing soldering quality or electronic component drop issue. So, what is the role of IMC layer in … Continue reading
