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Category Archives: Manufacture
Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution
Today, most of electronic components are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading
Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution
The trend in the electronics industry is toward smaller and smaller SMD components, with sizes such as 0402, 0201, and even 01005 becoming common (Note 1). Additionally, the pitch between pins on ICs has decreased to a fine pitch of … Continue reading
Jun17
Selectively/partial increase solder paste volume solutions
Why is it necessary to partially increase the solder paste volume in SMT soldering? To meet the demands of smaller and thinner electronic component designs, stencils are made as thin as possible to precisely control the tiny solder paste printed … Continue reading
Jun10
PCB rework: Selective solder mask removal by laser
As an engineer in the electronics manufacturing industry, have you ever encountered the need to rework a printed circuit board (PCB) to remove the solder mask? If so, how did you approach this problem? Traditionally, the solder mask is manually … Continue reading
Jun03
TQRDCE Performance Expectations and Review
This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and … Continue reading
