I am a Manufacturing Process Engineer (MPE)

Working for manufacturer engineering couple years. Sharing the manufacturing experience, skill, DFx, design, and information. Be care of this blog is personal share and content may not be 100% correctly.

Skip to content

Home
PCB Assembly
WorkingBear

Tag Archives: Laser

Subject Title	Views	Comments
PCB rework: Selective solder mask removal by laser	Views (7,552)	(0)

Seach This Blog
Tag Cloud
AOI BGA Component broken crack De-panel DFx FPC FVT Gasket HIP(Head-In-Pillow) HotBar HSC ICT IMC Laser LCM metal dome MLCC NWO(Non-Wet-Open) Packing PET PIH PTF red-dye&pry Reliability RFI/EMI shielding-can Soldering Solder paste Stencil Temperature Profile Troubleshooting Vendor Management Warpage
Sponsor
Categories
- Connector
- Corrugated Paper
- Design
- FPC
- Keypad
- Manufacture
- Material Introduction
- PCB
- Plastic
- Process
- Quality
- Reliability
- SMT
- Soldering
Bookmarks
- 電子製造，工作狂人(ResearchMFG)
Histats
Statcounter
Email Subscription

FeedBurner

Popular Articles
- [17,804] What is IMC (Intermetallic Compound) in the e...
- [15,830] Copper Defined vs. Solder Mask Defined pad de...
- [14,608] TQRDCE Performance Expectations and Review
- [13,549] How come the screw boss crack after mold-in s...
- [10,647] Why thinner PCB will need carrier for reflow ...
- [10,206] What is Step-up & Step-down Stencil? Selectiv...
- [8,710] How EMS fabricate a PCB Assembly?
- [8,515] What is PTF(Polymer Tick Film)? PTF introduct...
- [8,479] Case study for the mold-in insert screw boss ...
- [8,275] Why BGA soldering ball always crack(3)? IMC l...
Recent Posts
Recent Comments

Sponsor
Outbound link test

Check out researchmfg.com
Check out blogfuntw.com

I am a Manufacturing Process Engineer (MPE)

Proudly powered by WordPress.

Please disable your adblocker or whitelist this site!

The article is free to read and we do need the advertising sponsor.