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Category Archives: Design
Mar10
Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending
In the previous article, WorkingBear talked about how to improve the adhesion of PCA to resist the impact of stress. Today, We will move on to another topic: “How to increase the ability of components or circuit boards to resist … Continue reading
Mar07
Why BGA soldering ball always crack(7)? The Bonding force between solder pad of copper foil and PCB substrate
PCB is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP) stacked together. In modern PCB manufacturing, CCL has become a standard material. Each CCL manufacturer provides customers with product specifications that indicate the peel strength of the … Continue reading
Mar01
Why BGA soldering ball always crack(6)? The recommendation of BGA pad design from workingbear
Below are recommendations for BGA pad design to enhance the soldering strength from Workingbear. We had several pages talking about the relationship between solder cracking and bonding force. Workingbear personally doesn’t think that making design a change to the pad … Continue reading
Feb22
Why BGA soldering ball always crack(5)? Increase the contact area of solder to increase its strength
In the previous article, we talked about “How to Increase the bonding force for PCBA by using “Copper” base as the PCB surface finish“. Today, we will discuss further how the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) … Continue reading
Feb15
Why BGA soldering ball always crack(4)? Using "copper" base material as the surface finish for PCB
Following last discussion, we learned that solder cracking is caused when the stress placed upon it exceeds the strength of the bonding force. However, it’s possible to address this issue by increasing the bonding force of the printed circuit board … Continue reading
