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Category Archives: Design
Jun20
Preventing BGA Solder Joint Cracking: Strengthening Design from the Source
BGA solder joint cracking has always been a nightmare for electronic assembly (industry) manufacturer, and there are many reasons that are beyond the control of assembly manufacturer, but the final result is often required to be borne by assembly manufacturer. … Continue reading
May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs
Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the advantages and disadvantages for them? What are the design recommendations for them? … Continue reading
Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials
The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has … Continue reading
Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading
Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress
Manufacturing processes that may result in high stress in factories Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.
