This is an example that implement TRQDCE form for vendor survey.
TQRDCE Introduction:
The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and prompt corrective action by both the supplier and customer is essential for achieving continuous process improvement.
To enable customers to measure our suppliers, we have developed the TQRDCE (Technology, Quality, Responsiveness, Delivery, Cost, and Environmental) review. It is crucial for suppliers to maintain a competitive advantage by providing materials of the highest quality and lowest total cost, with the best delivery, responsiveness, and technology available. The TQRDCE review is a tool that measures and communicates a supplier’s performance, and assists the company in determining their position in future business relationships.
Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, inspecting the soldering result is challenging because the solder joints are hidden under the BGA body, and sometimes even 2D X-Ray inspection is insufficient. (5Dx or angle rotation X-Ray might be able to inspect BGA soldering quality, but these methods are expensive.)
Do you know how vendor ensure that their products are not damaged during shipping due to handling by transporters or delivery personnel? Reputable vendors put effort into designing and selecting suitable packaging materials for shipping to ensure the quality of their products. This article will introduce how vendor test whether their cardboard packaging meets general shipping requirements.
