Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development meeting, warning that if customers continue reporting BGA cracking issues, someone will be held accountable.
The real problem, however, stems from unrealistic expectations at the executive level. Leadership wants products to be thinner, lighter, and completed faster—shrinking the development timeline from 12 months to 9, and now just 6. At the same time, they expect flawless design execution with zero delays. Under this pressure, engineers are pushing themselves to the limit, often at the cost of their health. It’s worth asking: how did our company culture end up like this?
