Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

post on April 21, 2023

A parting line and gaps will appear between the joining surface of top and bottom molds in IC package

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture.

Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory floor or production line, as well as any environment the components are exposed to after being removed from vacuum-sealed packaging.

Please note that liquid or solid water cannot be counted as part of humidity! In fact, the human body can feel humidity. In a high humidity environment, you can feel that sticky sensation, like when it’s about to rain but hasn’t started yet, and your whole body feels damp.

read more…》

Manufacture, Moisture Sensitive, Process, Quality, SMT     WorkingBear    Views (2,996)     comment (0)

Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly

post on April 18, 2023

“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability.

Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) than typical PCB materials. As a result, temperature cycling tests often cause relative displacement, leading to mechanical fatigue and problems such as solder joint detachment or cracking. Later, this Underfill technology was also widely used under some BGA packages to improve their reliability when soldered onto the PCB and to prevent them from falling or dropping.

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Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (4,042)     comment (0)
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Apr13
Red Dye Penetration Test to check for BGA solder joint cracking

post on April 13, 2023

簡介用紅墨水試驗 (Red Dye Penetration Test)查看BGA焊錫有否破裂

The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on the SMT of printed circuit board (PCB) assemblies, and can assist engineers in verifying the quality of electronic component soldering.

Because the Red Dye test is a destructive experiment, it is typically only used on assembled PCBs (printed circuit boards) that cannot be inspected for issues using other non-destructive methods. Additionally, it is almost exclusively used for analyzing ICs (integrated circuits) with BGA (Ball Grid Array) packaging because the solder joints are located beneath the component and cannot be visually inspected using optical instruments.

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Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (6,550)     comment (0)
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Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources

post on April 11, 2023

Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future!

Usage Environment is the Biggest Challenge of Stress Sources

After discussing the precautions and solutions for stress during assembly, let’s talk about the biggest source of stress for electronic products: the usage environment of end customers.

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Design, PCB/FPC/PTF, Quality, SMT, Soldering     WorkingBear    Views (3,117)     comments (3)
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Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress

post on April 6, 2023

電子零件掉落或錫裂一定是SMT製程問題迷思(12)？製造工廠中可能出現較大應力的製程

Manufacturing processes that may result in high stress in factories

Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.

read more…》

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (1,830)     comment (0)
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