Jul13
What is blind hole, buried hole and plating hole for PCB?

post on July 13, 2023

What is blind hole, buried hole and plating hole for PCB?

In the early response to a user’s question, WorkingBear mistakenly mixed up the terms “blind hole” and “buried hole” when talking about PCBs. To prevent similar errors in the future, WorkingBear took the initiative to study some books about PCBs and clarify the concept of “vias” on PCBs.

As you may know, PCBs are made up of layers of copper foils stacked together. These “vias” are what connect different layers of circuits on the PCB. It’s similar to an underground system with interconnected tunnels. If you’ve played the video game “Super Mario,” you can think of it like the pipes that allow Mario to travel between different areas.

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Design, PCB/FPC/PTF     WorkingBear    Views (2,866)     comment (0)
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Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End

post on July 11, 2023

Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development meeting, warning that if customers continue reporting BGA cracking issues, someone will be held accountable.

The real problem, however, stems from unrealistic expectations at the executive level. Leadership wants products to be thinner, lighter, and completed faster—shrinking the development timeline from 12 months to 9, and now just 6. At the same time, they expect flawless design execution with zero delays. Under this pressure, engineers are pushing themselves to the limit, often at the cost of their health. It’s worth asking: how did our company culture end up like this?

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Design, Glue/adhesive/epoxy/underfill,, Quality, SMT, Soldering     WorkingBear    Views (2,180)     comment (0)
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Jul04
Exploring EVT/DVT/PVT: Explaining the Three Crucial Validation Stages in New Product Development

post on July 4, 2023

When developing a new product, it is common to conduct a “trial run” to obtain a prototype sample. This serves two purposes: firstly, it allows developers to further test and validate the prototype’s functionality, and secondly, it helps the manufacturing factory understand the production process and prepare for mass production. Feedback and suggestions based on the prototype’s test results are provided by various departments involved.

In general, the manufacturing side contributes insights regarding DFM (Design For Manufacturing) and production-related aspects to ensure that the product’s design, while impressive in functionality and appearance, can be efficiently manufactured. Other departments, such as Design Quality (DQ), provide feedback on the results of functionality verification tests, and the market maintenance team may offer suggestions regarding areas that could pose challenges for maintenance purposes.

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Design, Management, Process     WorkingBear    Views (5,136)     comment (0)
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Jun29
Why Don’t devices Fall Off on First Side during SMT Second Reflow? Does the solder MP increase during the second reflow?

post on June 29, 2023

Why don’t the electronic components on the first side of the double-sided PCB fall off due to re-melting of the solder during the second time reflow process in the SMT oven? How much does the melting temperature of the lead-free SAC305 solder alloy increase during the second time reflow process? Perhaps it’s because the components on the first side are more well-behaved and don’t cause trouble! This is just a joke, of course.

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SMT, Soldering     WorkingBear    Views (2,683)     comment (0)
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Jun20
Preventing BGA Solder Joint Cracking: Strengthening Design from the Source

post on June 20, 2023

BGA solder joint cracking has always been a nightmare for electronic assembly (industry) manufacturer, and there are many reasons that are beyond the control of assembly manufacturer, but the final result is often required to be borne by assembly manufacturer.

There are many reasons for BGA solder joint failure, but the main reason comes from PCB deformation, resulting in solder joints to be break under bending stress. PCB deformation usually comes from two reasons:

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Design, SMT, Soldering     WorkingBear    Views (2,984)     comment (0)
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