Aug01
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures

post on August 1, 2024

3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures

In recent years, the commercial application of 3D CT X-Ray has become increasingly noteworthy. As the technology matures, more companies are investing in its development, making the equipment more affordable, though still not quite at a consumer-friendly price point. Additionally, more laboratories equipped with 3D CT X-Ray are emerging, indicating that more electronics manufacturers are willing to invest in non-destructive testing. Workingbear has encountered at least two labs in Taiwan with 3D CT X-Ray equipment.

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Quality, Reliability, SMT, Soldering, Test/Inspection     WorkingBear    Views (4,059)     comment (0)
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Jul25
Effects of Nitrogen (N2) in SMT Reflow on Various Soldering Defects

post on July 25, 2024

Effects of Adding Nitrogen (N2) to SMT Reflow Ovens on Various Soldering Defects

“Oxidation” is a major enemy of solder quality, but oxidation is a natural law of elements striving for stability that cannot be avoided. Using nitrogen (N2) to isolate solder from oxygen (O2) is one of the few effective methods currently available to reduce oxidation of electronic components during high-temperature soldering.

Although nitrogen (N2) is not one of the noble gases of Group 8A, it is classified as an “inert gas” in modern chemistry. Nitrogen is very unreactive in nature, making it unlikely to form compounds with metals. It also makes up 78% of the atmosphere, making it relatively inexpensive to obtain. As a result, nitrogen is often used in SMT reflow ovens to replace oxygen, and in some wave soldering ovens, to reduce oxidation of solder or PCB pads at high temperatures.

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Quality, SMT, Soldering     WorkingBear    Views (5,171)     comment (0)
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Jul18
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?

post on July 18, 2024

Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?

In the early days, when electronic component design and manufacturing were still developing, the “burn-in” solution was used to screen out defective electronic components and products. This process allowed early-failing products to be identified and eliminated, preventing defective items from reaching customers and causing complaints. Statistical data shows that the lifespan of a batch of electronic products typically forms a “bathtub curve.” This means that there are higher rates of defective components at the beginning and end of their usage, but after a period of use, the defect rate drops to a near-zero stable state, resembling the shape of a bathtub curve.

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Process, Quality, Reliability, Test/Inspection     WorkingBear    Views (3,177)     comment (0)
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Jul11
What Is the Purpose of Testing Electronic Products? It’s Like Buying Insurance!

post on July 11, 2024

電子產品測試的目的所為何在？買保險也！

Workingbear has been in the electronics industry for several years and has noticed an interesting phenomenon. Almost every new manager will ask the same questions when they come on board: “Why do we need to perform ICT (In-Circuit Test) at the board level assembly?” and “Can we skip ICT tests?”

This is mainly because a “Keysight (Agilent) 3070” ICT test fixture can cost around US$15,000, equivalent to the price of a small car. And this cost is just for the fixture, excluding the test equipment. On the other hand, a simpler MDA (Manufacturing Defect Analyzer) fixture, such as the “TR-518,” only costs around US$1,700.

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Management, Personal Opinion, Process, Quality, Test/Inspection     WorkingBear    Views (2,622)     comment (0)
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Jun27
What is Function Verification Test (FVT) for Assembled Circuit Boards?

post on June 27, 2024

What is Function Verification Test (FVT) for Assembled Circuit Boards?

Function verification tests (FVT), or call Function Circuit Tests (FCT), are crucial for detecting defects in PCBA (Printed Circuit Board Assembly). These tests simulate the full functionality of the circuit board as if it were part of the final product. The goal is to identify and remove faulty boards before they are fully assembled into the final device, preventing wasted time and materials from having to disassemble and reassemble defective products.

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Process, Test/Inspection     WorkingBear    Views (6,722)     comment (0)