Dec12
Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement

post on December 12, 2023

Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement

In the realm of PCB assembly, the go-to technology in SMT (Surface Mount Technology) is what we call “Full Board Reflow Soldering.” While there are other methods for assembling PCBs, this “Full Board Reflow Soldering” can be divided into two flavors: “Single-Sided Board SMT Reflow” and “Double-Sided Board SMT Reflow.” These days, single-sided reflow seems to be taking a back seat because double-sided reflow lets us save precious space on the PCB, making our products more compact. That’s why you’ll find most boards in the market are crafted using the double-sided reflow technique.

(By the way, if space isn’t an issue, the single-sided board process could cut down one SMT cycle. When you weigh material costs against SMT labor costs, single-sided might just be the more cost-effective route.)

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Design, Process, SMT, Soldering     WorkingBear    Views (4,568)     comment (0)

Dec05
How Preventing Heavy Components from Falling during Secondary time SMT Reflow

post on December 5, 2023

How Preventing Heavy Components from Falling during Secondary time Reflow

With the rapid advancement of mobile communication technology, EMS (Electronic Manufacturing Services) providers worldwide are facing severe labor shortages. Furthermore, the Industry 4.0 trend has heightened the demand for automation in EMS facilities. As a result, many components that were previously not suited for Surface Mount Technology (SMT) are now required to meet the Paste-In-Hole (PIH) process. These components include Type A USB connectors, RJ45 Ethernet connectors, power sockets, transformers, and other relatively bulky parts. In the past, these components were typically soldered after SMT using wave soldering equipment or manual touch-up.

Due to the scarcity of manual labor and the need to save on subsequent manufacturing costs, along with quality considerations, many system manufacturers and EMS companies are gradually transitioning these non-SMT components to at least meet the PIH process requirements. This enables all electronic components to be soldered to the printed circuit board through a reflow oven.

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Design, Manufacture, SMT, Soldering     WorkingBear    Views (3,831)     comment (0)
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Nov28
When does SMT require Reflow Carriers and Full Process Carriers?

post on November 28, 2023

When does SMT require Reflow Carriers and Full Process Carriers?

What is an SMT Reflow Carrier? Why is it sometimes necessary in SMT production? And when do we need an SMT Full Process Carrier? Are there situations where neither is required?

The so-called “SMT reflow carriers or reflow templates” are essentially trays or carriers used to hold PCB (Printed Circuit Board) during the reflow soldering process. These carriers often feature positioning pillars to secure the PCB, preventing misalignment or deformation. Some advanced carriers even come with a lid, typically designed for Flexible Printed Circuit (FPC) use to avoid it from floating or lifting, equipped with magnets on both the upper and lower carriers acting as suction cups to firmly hold the board. This ensures the prevention of board deformation. In the case of rigid PCBs, a cover plate may also be used to secure specific components during the reflow process, preventing sliding.

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SMT, Soldering     WorkingBear    Views (2,878)     comment (0)
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Nov21
Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX

post on November 21, 2023

This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and terms might also be of interest to those working in roles such as Project Management (PM), New Product Introduction (NPI), or procurement guys within electronic companies.

Often, when attending meetings with engineers, you may hear these technical terms without a clear understanding of what they actually mean. Not to worry, in this brief guide, we’ll attempt to explain these engineering terms in simpler language. Feel free to check back for updates if you have more related questions in the future.

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Process, SMT     WorkingBear    Views (4,214)     comment (0)
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Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

post on November 16, 2023

What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

The “SMT dispensing” process,  also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB).  The term “SMT Red Glue” is derived from the prevalent use of red adhesives in SMT processes, with a few instances of yellow adhesives. As seen in the illustration at the beginning of this article, beneath small chip components like resistors and capacitors, there is a red, glue-like substance in the center, commonly referred to as red glue.

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Glue/adhesive/epoxy/underfill,, Process, Soldering     WorkingBear    Views (3,408)     comment (0)