Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

post on November 16, 2023

What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

The “SMT dispensing” process,  also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB).  The term “SMT Red Glue” is derived from the prevalent use of red adhesives in SMT processes, with a few instances of yellow adhesives. As seen in the illustration at the beginning of this article, beneath small chip components like resistors and capacitors, there is a red, glue-like substance in the center, commonly referred to as red glue.

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Glue/adhesive/epoxy/underfill,, Process, Soldering     WorkingBear    Views (3,223)     comment (0)

Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH

post on November 2, 2023

How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH

The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of the solder paste adheres to the leads of the component, while most remains on the PCB’s solder pads. When these assemblies pass through a high-temperature reflow oven, the solder paste on the leads and PCB pads melts, securely attaching the component to the circuit board. This method can effectively replace traditional processes like wave soldering or hand soldering.

This process is also known by other names such as “Pin-In-Paste (PIP),” “Intrusive Reflow Soldering (IRS),” and “Reflow Of Through-hole (ROT).”

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SMT, Soldering     WorkingBear    Views (7,952)     comment (0)

Oct26
5 Key PCB Layout Considerations for Efficient Circuit Board Assembly and Soldering Production Processes

post on October 26, 2023

When designing a PCB layout, various questions inevitably arise. Is this PCB best suited for a single-layer, double-layer, or multi-layer configuration? How should you protect against ESD/EMI? Will the printed circuit board assembly (PCBA) use a single-sided or double-sided process? Should the selection of electronic components be through-hole devices, surface mount devices, or a combination of both? This article will primarily focus on the PCB soldering production processes.

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Design, Process, Soldering     WorkingBear    Views (2,810)     comment (0)

Oct11
Do PCB Designs Require Reserving Board Edges and Grooves for Routers De-Paneling Machines?

post on October 11, 2023

Do PCB Designs Require Reserving Board Edges and Grooves for Routers De-Paneling Machines?

A while back, a netizen asked how the Router de-panel machine cuts PCB panels and whether there’s a need to reserve board edges (break-away) for the Router machine in PCB design. Upon careful consideration, I thought my previous answer might have been too brief. So, in this post, I’ve decided to delve deeper into these questions.

If you’re still unsure why PCBs are panelized before SMT and PCB assembly then de-paneling it into individual PCBA after assembly or what need to reserve board edges for Router machines in PCB design, please refer to the article titled “Why is Panelization and Break-away Tab Necessary in PCB Manufacturing, then De-paneling after PCBA is Completed?“

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Manufacture, PCB/FPC/PTF, Process, SMT     WorkingBear    Views (2,051)     comment (0)
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Oct04
How to Evaluate the Risk and Probability of Electronic Components Not Falling Off during SMT Second Reflow

post on October 4, 2023

How to Evaluate the Risk and Probability of Electronic Components Not Falling Off during SMT Second Reflow

PCB assembly through SMT double-sided reflow soldering has become the mainstream process in contemporary electronic manufacturing. However, occasionally, many individuals inquire, “Is there a method to proactively determine, or is there any calculation formula to predict the risk or rate of components falling off during the second reflow on the first side?”

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Manufacture, SMT, Soldering     WorkingBear    Views (3,871)     comment (0)
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