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Category Archives: Soldering
Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength
Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading
Jul01
Why do thinner PCBs will need carrier for reflow process?
As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want strong, robust, sturdy assemblies that … Continue reading
Jun17
Selectively/partial increase solder paste volume solutions
Why is it necessary to partially increase the solder paste volume in SMT soldering? To meet the demands of smaller and thinner electronic component designs, stencils are made as thin as possible to precisely control the tiny solder paste printed … Continue reading
May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume
Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading
May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?
We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading
