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Category Archives: Soldering
Nov14
How to print solder paste on PC Board and screen printing notices?
Printing the solder paste on the PCB (Printed Circuit Board) and go through reflow oven to re-melt the solder paste and solder the electronic components on PCB is most common process in today’s electronics manufacturing industry. Printing the solder paste … Continue reading
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering
Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading
Mar09
What Process Impact of Substituting SMDs with Paste-In-Hole components?
One day, my manager asked me a question: “Will changing the components from SMDs (Surface Mount Devices) to THDs (Through Hole Devices) and using the PIH (Paste-In-Hole) process affect the process and design?” I later realized that the question aimed … Continue reading
Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution
Today, most of electronic components are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading
