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Category Archives: Soldering
Mar01
Why BGA soldering ball always crack(6)? The recommendation of BGA pad design from workingbear
Below are recommendations for BGA pad design to enhance the soldering strength from Workingbear. We had several pages talking about the relationship between solder cracking and bonding force. Workingbear personally doesn’t think that making design a change to the pad … Continue reading
Feb22
Why BGA soldering ball always crack(5)? Increase the contact area of solder to increase its strength
In the previous article, we talked about “How to Increase the bonding force for PCBA by using “Copper” base as the PCB surface finish“. Today, we will discuss further how the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) … Continue reading
Feb15
Why BGA soldering ball always crack(4)? Using "copper" base material as the surface finish for PCB
Following last discussion, we learned that solder cracking is caused when the stress placed upon it exceeds the strength of the bonding force. However, it’s possible to address this issue by increasing the bonding force of the printed circuit board … Continue reading
Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading
Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading
