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Category Archives: Soldering
Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading
Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress
Manufacturing processes that may result in high stress in factories Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.
Mar29
Why BGA soldering ball always crack(11)? Stress is the Biggest Culprit in Causing BGA Solder Joint Cracks
The earlier sections of the article that Workingbear spent a lot of time discussing how to strengthen the bonding force of PCBAs and increase the stress resistance of electronic products. Now, we can finally talk about the biggest culprit causing … Continue reading
Mar21
Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change
Reducing the Impact of Stress on PCB Deformation through Mechanism Design In earlier sections, WorkingBear briefly mentioned the possible solution by changing mechanism design to address the problem of solder cracking. One such approach involves replacing the SMDs (surface mount … Continue reading
Mar15
Why BGA soldering ball always crack(9)? Increase the resistance of components to stress
How to increasing the ability of components to resist stress?(Continuing from the previous article) 2. No solder balls on BGA four corners, or use dummy balls instead of them. If you had studied the actual phenomenon of BGA solder cacking … Continue reading
