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Category Archives: Soldering
Aug17
An Option for Adding More Solder – Solder Preforms
“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading
Aug01
What is OSP (Organic Solderability Preservative) Surface Treatment for PCB? What are its Pros and Cons?
OSP (Organic Solderability Preservative) is a special chemical coating applied to the surface of copper on a PCB (Printed Circuit Board). This coating forms a thin protective film that keeps the bare copper from rusting or corroding when it’s stored. … Continue reading
Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?
WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading
Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End
Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading
Jun29
Why Don’t devices Fall Off on First Side during SMT Second Reflow? Does the solder MP increase during the second reflow?
Why don’t the electronic components on the first side of the double-sided PCB fall off due to re-melting of the solder during the second time reflow process in the SMT oven? How much does the melting temperature of the lead-free … Continue reading
