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Category Archives: Soldering
Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading
Oct08
What Can an SPI (Solder Paste Inspection) Machine Really Do?
SPI stands for Solder Paste Inspection. If we’re talking about the actual inspection equipment, people usually add “machine” after SPI. But in most cases, when you mention SPI in an SMT factory, everyone just assumes you’re talking about the inspection … Continue reading
Sep30
How PCB S/M and Silkscreen Thickness Can Mess with Solder Paste Volume and Even Cause BGA Shorts!
Over the past few days, Workingbear came across an issue I hadn’t really considered before. Here’s the story: an EMS (electronics manufacturing service) factory reported that during SMT production, they were seeing solder shorts under BGA components. After digging into … Continue reading
May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It
One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading
Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?
Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading
