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Category Archives: SMT
Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force
What is the actual root cause of BGA solder ball cracking? Stress is higher than its bonding-forces. The root cause of BGA solder ball cracked is stress higher than bonding-forces. Stress is higher than bonding-force is the certain result of … Continue reading
Nov14
How to print solder paste on PC Board and screen printing notices?
Printing the solder paste on the PCB (Printed Circuit Board) and go through reflow oven to re-melt the solder paste and solder the electronic components on PCB is most common process in today’s electronics manufacturing industry. Printing the solder paste … Continue reading
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
Jan05
Comparison between shielding-can directly mount and shielding-clip/frame
Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading
Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering
Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading
