Category Archives: SMT


Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

post on June 19, 2017

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading →

Design, Manufacture, PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (6,287)     comment (0)
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Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

post on January 5, 2017

Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading →

Design, Manufacture, SMT     WorkingBear    Views (6,223)     comment (0)
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Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering

post on April 7, 2016

Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading →

Design, Manufacture, SMT, Soldering     WorkingBear    Views (6,653)     comment (0)
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Mar09
What Process Impact of Substituting SMDs with Paste-In-Hole components?

post on March 9, 2016

One day, my manager asked me a question: “Will changing the components from SMDs (Surface Mount Devices) to THDs (Through Hole Devices) and using the PIH (Paste-In-Hole) process affect the process and design?” I later realized that the question aimed … Continue reading →

Manufacture, SMT, Soldering     WorkingBear    Views (5,794)     comment (0)
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Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution

post on February 1, 2016

Today, most of electronic components are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading →

Manufacture, SMT, Soldering     WorkingBear    Views (7,795)     comment (0)
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