Category Archives: Process


Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?

post on July 22, 2021

Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (7,206)     comments (1)
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Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？

post on December 19, 2018

What is the IMC, the Intermetallic Compound? We always heard the manufacturing engineer or some of Mechanical Engineer talking about this keyword when discussing  soldering quality or electronic component drop issue. So, what is the role of IMC layer in … Continue reading →

Process, Soldering     WorkingBear    Views (39,375)     comments (3)

Dec05
Both solder joint bridging and open solder joint happen at same BGA?

post on December 5, 2018

Is that possible for both solder joint bridging and open solder joint defect occur in the same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is rare to observe both solder joint bridging and open solder joint … Continue reading →

Process, Quality, Soldering     WorkingBear    Views (7,800)     comment (0)
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Jul01
Why do thinner PCBs will need carrier for reflow process?

post on July 1, 2015

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading →

Design, Glue/adhesive/epoxy/underfill,, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (14,120)     comments (2)
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