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Category Archives: Process
Dec19
Understanding the Impact of Solder Paste and Flux Composition on Electronic Board Assembly Quality
Solder paste is a crucial material in the domain of modern electronic assembly technology. It is used for soldering electronic components onto printed circuit boards (PCBs), this enabling the creation of ever-evolving technological products. The invention of solder paste played … Continue reading
Dec12
Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement
In the realm of PCB assembly, the go-to technology in SMT (Surface Mount Technology) is what we call “Full Board Reflow Soldering.” While there are other methods for assembling PCBs, this “Full Board Reflow Soldering” can be divided into two … Continue reading
Nov21
Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX
This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading
Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?
The “SMT dispensing” process, also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB). The term “SMT Red Glue” … Continue reading
Oct26
5 Key PCB Layout Considerations for Efficient Circuit Board Assembly and Soldering Production Processes
When designing a PCB layout, various questions inevitably arise. Is this PCB best suited for a single-layer, double-layer, or multi-layer configuration? How should you protect against ESD/EMI? Will the printed circuit board assembly (PCBA) use a single-sided or double-sided process? … Continue reading
