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Category Archives: Design
Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering
Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading
Jul01
Why do thinner PCBs will need carrier for reflow process?
As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want strong, robust, sturdy assemblies that … Continue reading
Jun24
Case study for the mold-in insert screw boss broken
In a previous discussion, WorkingBear identified potential root causes for screw boss cracking after mold-in screw nut insertion. Following a complaint from the field, we asked EMS and the plastic injection supplier to double-check their inventory and found that approximately … Continue reading
May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume
Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading
May20
Shipping carton drop/impact test condition
Do you know how vendor ensure that their products are not damaged during shipping due to handling by transporters or delivery personnel? Reputable vendors put effort into designing and selecting suitable packaging materials for shipping to ensure the quality of … Continue reading
