I am a Manufacturing Process Engineer (MPE)

Working for manufacturer engineering couple years. Sharing the manufacturing experience, skill, DFx, design, and information. Be care of this blog is personal share and content may not be 100% correctly.

Skip to content

Home
PCB Assembly
WorkingBear

Tag Archives: Packing

Subject Title	Views	Comments
Shipping carton drop/impact test condition	Views (1,594)	(0)

Email Subscription

FeedBurner
Seach This Blog
Tag Cloud
AOI BGA Component broken crack De-panel DFx FPC FVT Gasket HIP(Head-In-Pillow) HotBar HSC ICT IMC Laser LCM metal dome MLCC NWO(Non-Wet-Open) Packing PET PIH PTF red-dye&pry Reliability RFI/EMI shielding-can Soldering Solder paste Stencil Temperature Profile Troubleshooting Vendor Management Warpage
Categories
- Connector
- Corrugated Paper
- Design
- FPC
- Keypad
- Manufacture
- Material Introduction
- PCB
- Plastic
- Process
- Quality
- Reliability
- SMT
- Soldering
Bookmarks
- 電子製造，工作狂人(ResearchMFG)
Histats
Statcounter

Popular Articles
- [9,898] Copper Defined vs. Solder Mask Defined pad de...
- [8,583] How come the screw boss crack after mold-in s...
- [8,214] TQRDCE Performance Expectations and Review
- [7,289] Why thinner PCB will need carrier for reflow ...
- [6,851] What is Step-up & Step-down Stencil? Selectiv...
- [6,086] What is PTF(Polymer Tick Film)? PTF introduct...
- [6,006] How EMS fabricate a PCB Assembly?
- [5,036] Case study for the mold-in insert screw boss ...
- [4,979] PCB rework: Selective solder mask removal by ...
- [4,900] WorkingBear
Recent Posts
Recent Comments

Outbound link test

Check out researchmfg.com
Check out blogfuntw.com

I am a Manufacturing Process Engineer (MPE)

Proudly powered by WordPress.