Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination DFx ECM (Electrochemical migration) ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Design
Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading
Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
This article will talk about the composition of the PCBA bonding-force. There are numerous factors and elements involved in PCBA bonding force. However, Workingbear believes that we can utilize the findings of the red dye test to examine this issue. … Continue reading
Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force
What is the actual root cause of BGA solder ball cracking? Stress is higher than its bonding-forces. The root cause of BGA solder ball cracked is stress higher than bonding-forces. Stress is higher than bonding-force is the certain result of … Continue reading
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
Jan05
Comparison between shielding-can directly mount and shielding-clip/frame
Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading
