Category Archives: Design


Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading

Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

Recently one of my top manager ask to mount the shielding-can or call shielding-cover directly on the Printed Circuit Board to instead of mount the shielding-clip or call shielding-frame on the board first then cover the shieling-can. He said this … Continue reading

Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering

Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading

Jul01
Why do thinner PCBs will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading

Jun24
Case study for the mold-in insert screw boss broken

In a previous discussion, WorkingBear identified potential root causes for screw boss cracking after mold-in screw nut insertion. Following a complaint from the field, we asked EMS and the plastic injection supplier to double-check their inventory and found that approximately … Continue reading