Author Archives: WorkingBear
Jul22
Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance
Figcaption: Should BGA Pads Be Designed as SMD or NSMD? Pros, Cons, and Drop-Test Performance Do you know the difference between SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) pad designs for PCB? What are the advantages and disadvantages … Continue reading
Jul16
BGA Failure Analysis: Manufacturing Issue or Design Flaw?
Figcaption: How to Determine Whether a BGA Solder Joint Crack or Component Detachment Is Caused by the SMT Process or Product Design Many engineers have asked the same question: When a BGA solder joint cracks or a BGA component falls … Continue reading
Jul08
BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects
Figcaption：BGA Cross-Section Analysis: How to Evaluate Solder Joint Quality and Identify Common Defects This article is intended for anyone who isn’t yet familiar with how to evaluate the quality of BGA solder joints from cross-section images. Workingbear happens to have … Continue reading
Jun30
What Does CMF Mean in New Product Development Meetings?
What Does CMF Mean in New Product Development Meetings? During new product development meetings, We often hears project managers (PMs) asking mechanical engineers (MEs) to confirm the CMF with the Industrial Design (ID) and Marketing teams before moving forward with … Continue reading
Jun25
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development
What Is POC (Proof of Concept)? Its Role and Relationship with EVT, DVT, and PVT in New Product Development(This article discusses POC from the perspective of electronic hardware product development. Since Workingbear is not familiar with software development, POC practices … Continue reading
